With the increase of electronic devices, the electromagnetic environment has become more complex. Electronic devices need to be able to work in a complex electromagnetic environment, and must not interfere with other devices or be disturbed by other devices. Allied developed conductive silicon products which is able to provide solutions for complex electromagnetic environments to achieve electromagnetic compatibility of electronic products.
The co-extruded conductive rubber composite material is a new type of polymer material that is compounded with a non-conductive silicone rubber by adding conductive particles in the silicone rubber. The co-extruded conductive rubber composite material is manufactured by special equipment and processes to make the two parts combined tightly. The product has good electrical conductivity and electromagnetic shielding effectiveness, excellent waterproof property, corrosion resistance.
The non-stretch gasket is a new solution that Allied offers to customers in the high-precision and rapid assembly process. This solution is achieved by adding a non-stretch wire to the silicone material and co-extruding it. The material of the wire material can be selected from metal or textile depending on the application. Because the length direction can not be stretched, it can effectively reduce the assembly difficulty and improve assembly accuracy.
The conductive cloth is wrapped on the foam, and after a series of treatments, it has a good surface conductivity. It self-adhere to the mechanical parts to fill the gap between different mechanical parts, so as to achieve the effect of electromagnetic shielding.
Form-in-place, abbreviated as FIP, refers to the use of precision computer-controlled automated equipment to dispense fluid conductive rubber directly onto the surface of a metal or plastic housing and curing under certain conditions to form a conductive or non-conductive gasket, which is to achieve EMI shielding and environmental sealing effect.
The metal shield is stamped and formed from metal material and is divided into a base and a cover. The base can be directly SMT on the circuit board, and the cover can be assembled manually or by machine.